Put deep modules in shallow cases

This 3D-printed bracket brings a panel forward of the case rails, allowing a module to be inserted in a case that would otherwise be too shallow for it, at the cost of 2 HP.

Currently, extra-long screws are required. A future version might allow for using two sets of screws (one from the bracket to the case and one from the module to the bracket), which could also reduce the HP required to 1 by allowing a 0.5 HP offset. (However, figuring out how to make it possible to insert the screws and still have structural integrity could be tricky.)

3D model files not yet published, but they will be.

This ModularGrid entry represents the left half of the shim. Make a copy and flip it for the right half.